High-Quality Surface-Mount Assembly on Automated SMT Production Lines
High-precision surface-mount assembly of printed circuit boards at ElektroMont is performed on three almost identical, fully automated SMT production lines. The applied surface-mount assembly technology enables the fast and accurate placement of extremely small SMD components, including leadless devices and components with very short leads.
The production system provides a capacity of up to 1,750,000 surface-mounted components per day, ensuring stable serial production while also supporting accelerated manufacturing requirements.
The PCB size range that can be processed extends from 50 × 50 mm up to 510 × 460 mm. The supported component size range begins at 01005 packages and extends to larger components measuring up to 120 × 90 mm or 150 × 25 mm.
Precision Solder Paste Printing and
Pick & Place Technology
Before component placement, solder paste is applied to customer-specified PCBs using Panasonic SPG-2 automatic stencil printers. Laser-cut stainless steel stencils and carefully selected solder paste types ensure an even and stable soldering foundation for the assembly process.
Placement of SMD components is performed by modern Panasonic AM100 Pick & Place machines. Components supplied in tube, tape, or tray packaging are positioned in a fully automated process that minimizes deviations resulting from manual intervention and ensures consistently high placement accuracy.
Reflow Ovens and
Optimized Thermal Profiles
In the final stage of the surface-mount assembly process, SMT soldering is performed in forced-convection Heller reflow ovens operating in a nitrogen atmosphere. Soldering is carried out according to the solder paste manufacturer’s specifications or using customized thermal profiles optimized for the specific product.
The use of ovens with different heating zone configurations allows the creation of precise temperature profiles, which is particularly important for complex assemblies or thermally sensitive components. Individual thermal profile measurements ensure stable and reliable solder joints.
Automated PCB Handling and Quality Inspection
PCB loading, transport, and unloading are handled by Nutek board loaders, board unloaders, and conveyor systems. This automated board handling system allows PCBs to move through the entire production line without direct human contact.
Soldering quality is verified using automated optical inspection (AOI). When required, X-ray inspection is also available to verify hidden solder joints. This inspection capability is particularly important for BGA components and other fine-pitch devices where internal solder connections cannot be visually inspected.
Surface-Mount Assembly for Prototypes and Serial Production
For prototype manufacturing, a vapor phase soldering system is also available for surface-mount assembly. This technology provides precise and uniform heat transfer, making it particularly suitable for development projects and small production batches where flexibility and controlled thermal processes are essential.
The combination of automated surface-mount assembly, optimized thermal profiling, and multi-stage inspection ensures stable, documented, and high-precision electronics manufacturing.
